Category: Technology

Symposium V

Materials for Additive Manufacturing: From Fundamentals to Applications

Symposium Scope

Additive manufacturing (AM) enables the production of components with unlimited geometrical freedom by joining materials together, usually in a layer-by-layer fashion. This disruptive manufacturing process has inspired several industries to redesign components for optimized weight and reduced number of parts. However, the limited reproducibility of 3D printed materials and their large scatter in properties hamper the adoption of AM as a routine manufacturing technology.

The goal of this symposium is to discuss materials-related challenges in AM and to share on the technological advances that may help improve the quality and reliability of 3D printed materials. We welcome contributions aimed to understand the complex processes involved in AM across different length and time scales, using both simulation and experiments. The symposium will also serve as a platform to introduce novel techniques and materials design strategies that may foster the integration of AM components in industry.

Topics

Specific topics include, but are not limited to:

Novel AM techniques:
– Large/small scale 3D printing, hybrid AM techniques, advances in laser/e-beam AM technologies, inline process qualification & feedback to fabrication, etc.;

Materials Design:
– processing-structure-property relationships of AM materials, novel materials designs, site-specific microstructure and composition control, development of AM material feedstock (powders, pastes, and inks), etc.;

Materials Characterization:
– Heterogeneity and reliability of 3D printed materials, Materials data analysis, in-situ and ex-situ characterization of AM materials, high-throughput assessment of AM materials;

Modeling & Simulation of AM Processes:
– Multiscale modeling of AM processes, microstructure evolution during AM processes, predictive models for AM materials performance/properties;

Industrial Applications of AM:
– Industrial case-studies, certification of AM parts, AM process control, cost effectiveness of AM

Standardization Efforts for AM:
– Existing and evolving standards for AM materials, processes, parts and property characterization

List of Speakers

  • Jay CARROLL, Sandia National Laboratories, USA
  • Kai CHEN, Xi’an Jiaotong University, China
  • Eduard HRYHA, Chalmers University of Technology, Sweden
  • Yong Lin KONG, University of Utah, USA
  • Christian LEINENBACH, EMPA Dubendorf, Switzerland
  • John LEWANDOWSKI, Case Western Reserve University, USA
  • Manyalibo (Ibo) MATTHEWS, Lawrence Livermore National Lab, USA
  • Chun Wee MOK, BeAM, Singapore
  • Sharon NAI, Singapore Institute of Manufacturing Technology, A*STAR, Singapore
  • Thomas NIENDORF, Universität Kassel, Germany
  • Minh-Son PHAM, Imperial College London, UK
  • Behrang POORGANJI, GE Additive, USA
  • Upadrasta RAMAMURTY, Nanyang Technological University, Singapore
  • Mike REGAN, HP, Singapore
  • Mohsen SEIFI, ASTM International, USA
  • Ralph SPOLENAK, ETH Zurich, Switzerland
  • Sebastian THOMAS, Monash University, Australia
  • Guglielmo VASTOLA, Institute of High Performance Computing, A*STAR, Singapore
  • Jun WEI, Singapore Institute of Manufacturing Technology, A*STAR, Singapore

Symposium Sponsors

  • BeAM Machines Pte Ltd
  • HP Singapore

Chairs

Matteo SEITA
Nanyang Technological University, Singapore

Yong-Wei ZHANG
Institute of High Performance Computing, A*STAR, Singapore

Co-Chairs

Jun WEI
SIMTech, A*STAR, Singapore

Kai CHEN
Xi’an Jiaotong University, China

Christian LEINENBACH
Empa Dubendorf, Switzerland

John LEWANDOWSKI
Case Western Reserve University, USA

Correspondence

Matteo SEITA
Nanyang Technological University, Singapore

Email: mseita@ntu.edu.sg

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