Category: Technology

Symposium U

Materials and Devices for Harsh Environment

Basic and applied research on innovative materials and device development in three interdisciplinary themes:

1. Defence
• Protective materials/structures;
• Camouflage materials;
• High energy laser materials;
• High speed dynamic impact;
• High temperature environment.

2. Aerospace
• Light weight, high strength composites;
• Heat and corrosion effects;
• Materials fatigue;
• High power devices.

3. Space
• Coatings for space environment;
• Radiation effects on electronics;
• Low vacuum (outgassing) effects;
• Thermal management.

  • Light weight, high energy absorbance materials and composites;
  • Shape memory materials (SMA/SMP/SMC);
  • Nanomaterials and nano-reinforced composites (e.g. CNT, graphene, nanofibers);
  • Advanced ceramics and coatings (high temperatures, anti-oxidation, anti-corrosion);
  • Intelligent/smart materials;
  • Self-healing materials;
  • Additive manufacturing for material and devices;
  • Materials for mitigating ionizing radiation, high-energy laser & nucleation threat;
  • Ruggedized electronic materials and devices;
  • Environmentally-assisted materials degradation and failure (e.g. corrosion, impact, thermal shock, low vacuum);
  • Nanomechanical behavior of materials;
  • Reliability, physics and chemistry behind material failure;
  • Radiation and single event effects;
  • Computational and analytical modeling.
  • Jinsjhun BI, University of Chinese Academy of Sciences, China
  • Asaf BOLKER, Soreq NRC, Israel
  • Xiaowei CHEN, Beijing Institute of Technology, China
  • Mengu CHO, Kyushu Institute of Technology, Japan
  • Glenn DAEHN, Ohio State University, USA
  • Zehui DU, Nanyang Technological University, Singapore
  • Sophie DUZELLIER, ONERA, France
  • Daniel FLEETWOOD, Vanderbilt University, USA
  • Qiang GUO, Shanghai Jiao Tong University, China
  • En-Hou HAN, Institute of Metal Research, CAS, China
  • Shashi KARNA, US Army Reseach Lab, USA
  • Katsuyoshi KONDOH, University of Osaka, Japan
  • Changquan LAI, Nanyang Technological University, Singapore
  • Holden LI, Nanyang Technological University, Singapore
  • Govind MALLICK, US Army Reseach Lab, USA
  • Dale MCMORROW, Naval Research Laboratory, USA
  • Kilian PFAAB, CNES, France
  • Jérôme PUECH, CNES, France
  • Werner RIEDEL, Fraunhofer Institute for High-Speed Dynamics, Ernst-Mach-Institut, Germany
  • Eric RIUS, CNRS, France
  • Christopher A. SCHUH, Massachusetts Institute of Technology, USA
  • Edwin TEO, Nanyang Technological University, Singapore
  • Carl THOMPSON, Massachusetts Institute of Technology, USA
  • Jianming YUAN, Nanyang Technological University, Singapore
  • Liying ZHANG, Donghua University , China
  • Alfred ZINN, Kuprion Inc, USA


Chee Lip GAN
Nanyang Technological University, Singapore

Christopher A. SCHUH
Massachusetts Institute of Technology, USA


Centre National d’études Spatiales, France

Qiang GUO
Shanghai Jiao Tong University, China

Zehui DU
Nanyang Technological University, Singapore


Chee Lip GAN
Nanyang Technological University, Singapore